Process Hierarchy

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  Spectrophotometric film thickness measurement
Materials polyimide on silicon, phosphosilicate glass on silicon, photoresist on silicon dioxide, borophosphosilicate glass on silicon, silicon nitride on silicon, photoresist on silicon nitride, photoresist on quartz, amorphous silicon on quartz, silicon dioxide on silicon, polyimide on silicon nitride, polysilicon on silicon dioxide, platinum on silicon dioxide, amorphous silicon on silicon, silicon nitride on quartz, amorphous silicon on silicon dioxide, photoresist on silicon
Sides processed either
Thickness 20 .. 5000 nm
Wafer size
Wafer size
Equipment Nanometrics NanoSpec
Equipment characteristics:
Batch sizes 100 mm: 1, 150 mm: 1
Piece dimension
Range of wafer piece dimensions the equipment can accept
2 .. 150 mm
Piece geometry
Geometry of wafer pieces the equipment can accept
triangular shard, other, rectangular, irregular, circular
Piece thickness
Range of wafer piece thickness the equipment can accept
300 .. 2000 µm
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, notched, no-flat
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon on insulator, silicon
Wafer thickness
List or range of wafer thicknesses the tool can accept
300 .. 2000 µm
Extra terms