on front Contact photolithography (Spray coat) |
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| Process characteristics: |
| Alignment side |
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| Alignment tolerance Registration of CAD data to features on wafer |
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| Alignment type Choose fine alignment if the mask will be aligned to the marks on the wafer. |
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| Min feature size |
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| Perform hardbake Hardbake is optional for AZ5214E only.
No hardbake procedure is available for AZ 9245.
UV Stabilization available for AZ5214e resist and 100mm and 150mm diameter wafers only. |
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| Perform linewidth metrology Two measurement per wafer |
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| Perform microscope inspection 30 mins inspection per wafer |
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| Perform stylus profilometry One measurement per wafer |
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| Resist thickness |
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| Batch size |
1 |
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| Magnification |
1 |
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| Materials |
AZ 5214e |
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| Wafer size |
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