Contact photolithography (Manual): View

on front Contact photolithography (Manual)

Process characteristics:

Alignment side

Alignment tolerance

Registration of CAD data to features on wafer

unconstrained

Alignment type

Choose fine alignment if the mask will be aligned to the marks on the wafer.

Min feature size

unconstrained

Perform hardbake

Hardbake is optional for AZ5214E only.
No hardbake procedure is available for AZ 9245.
UV Stabilization available for AZ5214e resist and 100mm and 150mm diameter wafers only.

Perform linewidth metrology

Two measurement per wafer

Perform microscope inspection

30 mins inspection per wafer

Perform stylus profilometry

One measurement per wafer

Resist thickness

Batch size

Magnification

Materials

AZ 9245, AZ 5214e

Wafer size

Comments:

50mm, 75mm, 100mm and 150mm diameter wafers can be accommodated, unless the UV stabilization option is selected for the "Hardbake". In this case, only 100mm and 150mm wafers can be handled.
The linewidth metrology includes measurements at two different sites on the wafer. Please provide details about the inspection sites, otherwise, if available only alignment marks will be inspected.
The microscope inspection includes only 30 mins of minimum inspection per wafer.
The stylus step-hight metrology includes only one measurement per wafer.
For any other or additional inspection, the customer will specify the location and nature of inspection, and it will be custom quoted.
See http://www.mems-exchange.org/users/litho-templates for information about layout requirements.