Process Hierarchy

on front
  Maskless laser write
Process characteristics:
Estimated write time per wafer
Estimated write time per wafer, must be 1 .. 480 min
1 .. 480 min
Sides processed either
Wafer size
Wafer size
Equipment Custom Heidelberg laser writer
Equipment characteristics:
Batch sizes 10 .. 100 mm: 1
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, notched, no-flat
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
fused silica, gallium arsenide, silicon on insulator, silicon, Pyrex (Corning 7740)
Wafer thickness
List or range of wafer thicknesses the tool can accept
100 .. 5000 µm