Custom Heidelberg laser writer

Type commercial
Equipment Characteristics
Batch sizes 10 .. 100 mm: 1
Wafer diameter(s)
List or range of wafer diameters the tool can accept
10 .. 100 mm
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, notched, no-flat
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
fused silica, gallium arsenide, silicon on insulator, silicon, Pyrex (Corning 7740)
Wafer thickness
List or range of wafer thicknesses the tool can accept
100 .. 5000 µm