Process Hierarchy

  Anti-stiction coating (Alkylhalosilanes)
Deposition 20 Å
Material DDMS
Sides processed both
Temperature 25 °C
Thickness 20 Å
Wafer size
Wafer size
Equipment Coater
  • The deposition apparatus is a prototype of a new commercial vapor phase deposition tool and can accommodate any sample/substrate size 200mm or smaller.
Equipment characteristics:
Batch sizes 100 mm: 1, 125 mm: 1, 150 mm: 1, 200 mm: 1, 50 mm: 5, 75 mm: 3
MOS clean no
Piece dimension
Range of wafer piece dimensions the equipment can accept
10 .. 200 mm
Piece geometry
Geometry of wafer pieces the equipment can accept
circular, irregular, other, rectangular, triangular shard
Piece thickness
Range of wafer piece thickness the equipment can accept
100 .. 10000 µm
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, no-flat, notched
Wafer holder
Device that holds the wafers during processing.
aluminum chuck, anodized aluminum, flat chuck, plate, teflon
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
alumina, BK7, Borofloat (Schott), ceramic, Corning 1737, Foturan (Schott), fused silica, gallium arsenide, gallium phosphide, glass (Hoya), glass-ceramic, indium phosphide, lithium niobate, other, Pyrex (Corning 7740), quartz (fused silica), quartz (single crystal), sapphire, silicon, silicon carbide, silicon germanium, silicon on insulator, silicon on sapphire, titanium
Wafer thickness
List or range of wafer thicknesses the tool can accept
100 .. 10000 µm
  • AS1 (Anti-Stiction Coater) can deposit most Alkylhalosilane SAM films. (FDTS, FOTS, DDMS, etc.) Precursors for anti-stiction can be requested by users.
  • DDMS is our preferred anti-stiction coating for the following reasons:
    1)Higher temperature stability
    2)Short chain precursor
    3)Better particle performance
    4)Low surface energy.
  • Reference articles and information regarding dichlorodimethylsilane (DDMS) are available. The properties of the DDMS monolayer can be found in prior publications by the Maboudian Group, Dept of Chemical Engineering, UC
  • Related References:
    W. R. Ashurst, M. P. de Boer, C. Carraro and R. Maboudian "An Investigation of Sidewall Adhesion in MEMS", Applied Surface Science 212-213 pp. 735-741 (2003).
  • W. R. Ashurst, C. Carraro, W. Frey and R. Maboudian "Wafer Level Anti-Stiction Coatings for MEMS", Sensors and Actuators A 104, 213-221(2003).
  • Please contact us for samples.
SPIE_paper.pdf (202.9 KB, application/pdf)
attached by appliedmst (Jeff Chinn) on 2003-08-10 19:29
Vapor Phase Anti-Stiction Description
Ashurst-Dichlorodimethylsilane.pdf (478.7 KB, application/pdf)
attached by appliedmst (Jeff Chinn) on 2003-08-10 19:28
Reference Article