Process Hierarchy

on front
  Maskless photolithography (front-front align) (Shipley 220)
MaterialShipley 220
on front
  3 Maskless Alignment
on front
  4 Maskless Exposure
MaterialShipley 220
on front
  7 Microscope inspection
Process characteristics:
Resist thickness
Thickness of photoresist.
Resist thickness
Thickness of photoresist. , must be 10 .. 80 µm
10 .. 80 µm
Batch size 1
Material Shipley 220
Sides processed either
Wafer size
Wafer size
Comments:
  • $100.00 setup fee.
  • Minimum of 4 wafers.