Process Hierarchy

  Photoresist softbake II
Sides processed both
Temperature 115 °C
Thermal duration 90 s
Wafer size
Wafer size
Equipment Hot plate
Equipment characteristics:
Piece dimension
Range of wafer piece dimensions the equipment can accept
10 .. 75 mm
Piece geometry
Geometry of wafer pieces the equipment can accept
rectangular, circular, triangular shard, irregular, other
Piece thickness
Range of wafer piece thickness the equipment can accept
100 .. 2000 µm
Wafer geometry
Types of wafers this equipment can accept
no-flat, 1-flat, 2-flat, notched
Wafer holder
Device that holds the wafers during processing.
heated plate
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
glass (category), Pyrex (Corning 7740), quartz (single crystal), silicon
Wafer thickness
List or range of wafer thicknesses the tool can accept
100 .. 2000 µm