Process Hierarchy

on front
  Photoresist coat with softbake (Shipley 1813)
  1 HMDS Prime
MaterialHMDSThickness1 nm
MaterialShipley 1813
MaterialShipley 1813
Process characteristics:
Resist thickness
Resist thickness*
must be 1.3 .. 2.5 µm
1.3 .. 2.5 µm
Excluded materials gold (category), copper
Material Shipley 1813
Wafer size
Wafer size
Extra terms