Process Hierarchy

  HMDS Prime
Batch size 25
Excluded materials gold (category), copper
Material HMDS
Sides processed both
Thickness 1 nm
Wafer size
Wafer size
Equipment Yield Engineering Systems YES-3
Equipment characteristics:
Wafer holder
Device that holds the wafers during processing.
stainless steel
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon, silicon dioxide
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 1000 µm
Extra terms