Process Hierarchy

on front
  Photoresist coat (Shipley 1813)
Process characteristics:
Amount of material added to a wafer
Amount of material added to a wafer, must be 1.3 .. 2.5 µm
1.3 .. 2.5 µm
Batch size 1
Excluded materials gold (category), copper
Material Shipley 1813
Sides processed either
Wafer size
Wafer size
Equipment Solitec 5110-C
Equipment characteristics:
Wafer holder
Device that holds the wafers during processing.
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon, silicon dioxide, alumina
Wafer thickness
List or range of wafer thicknesses the tool can accept
300 .. 1000 µm
Extra terms