Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
on front
  Photoresist coat with softbake (Shipley 1813)
  1 HMDS Prime
MaterialHMDSThickness1 nm
on front
  2 Photoresist coat (Shipley 1813)
MaterialShipley 1813
  3 Photoresist softbake (Shipley 1813)
MaterialShipley 1813
Process characteristics:
Resist thickness
Resist thickness*
must be 1.3 .. 2.5 µm
1.3 .. 2.5 µm
Excluded materials gold (category), copper
Material Shipley 1813
Wafer size
Wafer size
Extra terms
Customer agrees that wafers, masks, and other materials incorporating any process(es) provided by this fabrication site are to be used solely for non-commercial research purposes.