Contact photolithography (Manual

on front Contact photolithography (Manual - Negative)

Process characteristics:

Alignment type

Method used to align materials to be bonded.

Perform hardbake

100mm and 150mm diameter wafers only.

Perform linewidth metrology

Two measurement per wafer

Perform microscope inspection

30 mins inspection per wafer

Perform stylus profilometry

One measurement per wafer

Resist thickness

6 .. 95 µm

Batch size

Magnification

Material

Futurrex NR5-8000

Photoresist polarity

negative

Wafer diameter(s)

List or range of wafer diameters the tool can accept

50 mm, 75 mm, 100 mm, 150 mm

Wafer size

Comments:

50mm, 75mm, 100mm and 150mm diameter wafers can be accommodated, unless the UV stabilization option is selected for the "Hardbake". In this case, only 100mm and 150mm wafers can be handled.
The linewidth metrology includes measurements at two different sites on the wafer. Please provide details about the inspection sites, otherwise, if available only alignment marks will be inspected.
The microscope inspection includes only 30 mins of minimum inspection per wafer.
The stylus step-hight metrology includes only one measurement per wafer.
For any other or additional inspection, the customer will specify the location and nature of inspection, and it
See http://www.mems-exchange.org/users/litho-templates for information about layout requirements.
For PR strip please use the following process:
https://www.mems-exchange.org/catalog/P3476/