Wafer scale testing: View

Wafer scale testing

Batch size

File formats

List of CAD file formats supported (eg. GDSII, CIF)

AutoCAD, comma separated value files

Measurement unit

Resistance & Capacitance

Min bond pad size

Minimum characteristic dimension of bond pad.

50 µm

Wafer thickness

List or range of wafer thicknesses the tool can accept

200 .. 1000 µm

Wafer size

Equipment

AT&T Double-sided prober

Custom two probe system measuring resistance and capacitance to determine interconnect continuity and isolation respectively.
Standard Resistance 0.1 - 10MEG ohms
Standard Capacitance 0.1p - 1micro Farad
High Resolution Resistance 0.02 - 30MEG ohms
High Resolution Capcitance 0.02p - 10micro Farad

Equipment characteristics:

MOS clean

Wafer geometry

Types of wafers this equipment can accept

1-flat, 2-flat

Wafer holder

Device that holds the wafers during processing.

vacuum chuck

Wafer materials

List of wafer materials this tool can accept (not list of all materials, just the wafer itself).

alumina, BK7, Borofloat (Schott), ceramic, copper, Corning 1737, Foturan (Schott), fused silica, gallium arsenide, gallium phosphide, germanium, glass (Hoya), glass-ceramic, indium phosphide, lithium niobate, other, polyethylene, Pyrex (Corning 7740), quartz (fused silica), quartz (single crystal), sapphire, silicon, silicon carbide, silicon germanium, silicon on insulator

Comments:

File formats to include any x,y and net name information for the devices under test.
File format is flexible so long as x/y-coordinates and net name is given for each test point. Example programs can be emailed upon request.