Platinum lift-off: View

on front Platinum lift-off

on front

1 Contact photolithography (front-front align) (Shipley 1813)

Material	Shipley 1813

1.1 HMDS Prime

Material	HMDS	Thickness	1 nm

on front

1.2 Photoresist coat (Shipley 1813)

Material	Shipley 1813

1.3 Photoresist softbake (Shipley 1813)

Material	Shipley 1813

on front

1.4 Contact front-front alignment

on front

1.5 Contact G-line exposure

Depth	10 µm

on front

1.6 Photoresist develop (Shipley 1813)

Material	Shipley 1813

on front

2 Titanium DC-magnetron sputtering (low power)

Material	titanium

on front

3 Platinum DC-magnetron sputtering (high power)

Material	platinum

4 Lift-off etch

Material	Shipley 1813

on front

5 Stylus profilometer step measurement

Depth	100 µm

Process characteristics:

Thickness

0.1 .. 0.2 µm

Titanium thickness

0.05 .. 0.1 µm

Batch size

Excluded materials

gold (category), copper

Material

platinum

Max field size

100 mm

Min feature size

5 µm

Resist thickness

1.3 µm

Wafer size

Comments:

Total metal thickness must be less than 0.2 um.
The photoresist thickness should be >3X the platinum thickness.
100A thick titanium layer is used as a adhesion layer.
See http://www.mems-exchange.org/users/litho-templates for information about layout requirements.

Extra terms

Customer agrees that wafers, masks, and other materials incorporating any process(es) provided by this fabrication site are to be used solely for non-commercial research purposes.