SEM analysis: View

on front SEM analysis

Process characteristics:

Materials

Material(s) to inspect.

Materials

Available

Material(s) to inspect.

Excluded materials

gold (category), copper

Sides inspected

The sides of the wafer inspected by the process

either

Equipment

Hitachi S-4500 SEM

This SEM is a field emission electron microscope with two secondary electron detectors, a back scatter detector, and an infrared chamber scope. In addition, it has a Noran energy dispersive x-ray detection system for elemental analysis. The microscope is capable of operating at a spatial resolution of 15 angstroms at 15kV energy.

Equipment characteristics:

MOS clean

Piece dimension

Range of wafer piece dimensions the equipment can accept

1 .. 25 mm

Piece geometry

Geometry of wafer pieces the equipment can accept

circular, irregular, other, rectangular, triangular shard

Piece thickness

Range of wafer piece thickness the equipment can accept

0 .. 1 cm

Wafer materials

List of wafer materials this tool can accept (not list of all materials, just the wafer itself).

alumina, BK7, Borofloat (Schott), ceramic, copper, Corning 1737, Foturan (Schott), fused silica, gallium arsenide, gallium phosphide, germanium, glass (Hoya), glass-ceramic, indium phosphide, lithium niobate, other, Pyrex (Corning 7740), quartz (fused silica), quartz (single crystal), sapphire, silicon, silicon carbide, silicon germanium, silicon on insulator, silicon on sapphire, titanium

Extra terms

Customer agrees that wafers, masks, and other materials incorporating any process(es) provided by this fabrication site are to be used solely for non-commercial research purposes.