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Spectroscopic Ellipsometric Multi-Point Film Thickness Measurement: View
Process Hierarchy
Bonding
Clean
Consulting
Deposition
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
   Electrical metrology
   Geometric metrology
   Miscellaneous metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368

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Spectroscopic Ellipsometric Multi-Point Film Thickness Measurement
Batch size 1
Film thickness 0.01 .. 2 µm
Materials PZT, aluminum nitride, silicon nitride on silicon, silicon dioxide on silicon
Refractive index 1 .. 4
Sides processed either
Wafer size
Wafer size
Equipment Woollam Spectroscopic Ellipsometer
Equipment characteristics:
Piece dimension
Range of wafer piece dimensions the equipment can accept
50 .. 150 mm
Piece geometry
Geometry of wafer pieces the equipment can accept
circular, irregular, other, rectangular
Piece thickness
Range of wafer piece thickness the equipment can accept
200 .. 700 µm
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon, silicon on insulator