Spectrophotometric film thickness measurement: View

on front Spectrophotometric film thickness measurement

Batch size

Excluded materials

gold (category), copper

Materials

silicon nitride on silicon, silicon dioxide on silicon, photoresist on silicon, phosphosilicate glass on silicon, borophosphosilicate glass on silicon, amorphous silicon on silicon, polyimide on silicon, photoresist on silicon dioxide, silicon nitride on silicon dioxide, photoresist on silicon nitride, polyimide on silicon nitride, amorphous silicon on silicon dioxide, platinum on silicon dioxide, SIMOX, silicon on insulator, polysilicon on silicon dioxide, photoresist on quartz, silicon nitride on quartz, polysilicon on quartz, indium tin oxide on quartz, amorphous silicon on quartz, platinum on quartz, nickel on quartz, Nichrome on quartz

Sides processed

either

Thickness

20 .. 5000 nm

Wafer size

Equipment

Nanometrics NanoSpec/AFT 4000

Equipment characteristics:

Wafer holder

Device that holds the wafers during processing.

delrin

Wafer materials

List of wafer materials this tool can accept (not list of all materials, just the wafer itself).

silicon

Wafer thickness

List or range of wafer thicknesses the tool can accept

200 .. 1000 µm

Comments:

Each measurement consists of 5 measured locations on the wafer

Extra terms

Customer agrees that wafers, masks, and other materials incorporating any process(es) provided by this fabrication site are to be used solely for non-commercial research purposes.