Process Hierarchy

  Stoichiometric silicon nitride LPCVD
Process characteristics:
Perform clean
Perform clean*
yes no
Thickness
Amount of material added to a wafer
Thickness*
Amount of material added to a wafer, must be 0.1 .. 0.475 µm
0.1 .. 0.475 µm
Batch size 25
Excluded materials gold (category), copper
Material silicon nitride
Sides processed both
Wafer size
Wafer size