Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
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  Al sputtering (Metron)
Process characteristics:
Thickness
Amount of material added to a wafer
Thickness*
Amount of material added to a wafer, must be 0.01 .. 2 µm
0.01 .. 2 µm
Ambient
Ambient to which substrate is exposed during processing
 argon
Material aluminum
Pressure
Pressure of process chamber during processing
 7.5 mTorr
Sides processed either
Wafer size
Wafer size
Equipment Metron 3290
Equipment characteristics:
Batch sizes 100 mm: 1, 150 mm: 1, 75 mm: 1
Piece dimension
Range of wafer piece dimensions the equipment can accept
 0 .. 75 mm
Wafer holder
Device that holds the wafers during processing.
 aluminum chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 quartz (fused silica), silicon, silicon on insulator