Process Hierarchy

on front
  Photoresist coat with softbake (AZ 9260)
  1 HMDS Prime
MaterialHMDSThickness1 nm
MaterialAZ 9260
MaterialAZ 9260
Process characteristics:
Resist thickness
Resist thickness*
must be 6 .. 10 µm
6 .. 10 µm
Excluded materials gold (category), copper
Material AZ 9260
Wafer size
Wafer size
Extra terms