Process Hierarchy

on front
  Multipoly Recipe #2
  1.1 RCA clean
  1.2 HF Dip
MaterialpolysiliconResidual stress29 MPaThickness3.12 µm
Thickness20 .. 5000 nm
Process characteristics:
Perform clean
Perform clean*
yes no
Excluded materials gold (category), copper
Material polysilicon
Pressure
Pressure of process chamber during processing
1 atm
Sides processed both
Thickness 3.12 µm
Wafer size
Wafer size
Extra terms