Process Hierarchy

  HF Dip
Batch size 50
Excluded materials gold (category), copper
Process duration 0.5 min
Sides processed both
Temperature 20 °C
Wafer size
Wafer size
Equipment RCA hood
Equipment characteristics:
Wafer holder
Device that holds the wafers during processing.
teflon chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 1000 µm
Extra terms