Process Hierarchy

on front
  Aluminum DC-magnetron sputtering (low power)
Materialaluminum
Depth100 µm
Process characteristics:
Thickness
Amount of material added to a wafer
Thickness*
Amount of material added to a wafer, must be 0.1 .. 0.2 µm
0.1 .. 0.2 µm
Excluded materials gold (category), copper
Material aluminum
Wafer size
Wafer size
Comments:
  • Film thickness measurements are performed by stylus profilometry. A separate, partially-masked substrate is loaded along with each wafer and is used to measure the thickness of the as-deposited film.
Extra terms