Process Hierarchy

on front
  Stylus profilometer step measurement
Batch size 1
Contact force
Force applied at contact point
0.01 .. 0.4 mN
Depth 100 µm
Excluded materials gold (category), copper
Measurement unit angstrom, micron
Sides processed either
Wafer size
Wafer size
Equipment Veeco Dektak 3030ST
Equipment characteristics:
Wafer holder
Device that holds the wafers during processing.
stainless steel
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon, Borofloat (Schott), alumina, quartz (single crystal)
Wafer thickness
List or range of wafer thicknesses the tool can accept
100 .. 40000 µm
Extra terms