Process Hierarchy

on front
  PSG LPCVD
  1.1 RCA clean
  1.2 HF Dip
on front
  2 PSG LPCVD
Materialphosphosilicate glass
Thickness20 .. 5000 nm
Process characteristics:
Thickness
Amount of material added to a wafer
Thickness*
Amount of material added to a wafer, must be 0.1 .. 2 µm
0.1 .. 2 µm
Excluded materials gold (category), copper
Material phosphosilicate glass
Wafer size
Wafer size
Extra terms