Process Hierarchy

on front
  Chromium DC-magnetron sputtering (high power)
MaterialchromiumResidual stress93 MPa
Depth100 µm
Process characteristics:
Amount of material added to a wafer
Amount of material added to a wafer, must be 0.1 .. 2 µm
0.1 .. 2 µm
Excluded materials gold (category), copper
Material chromium
Wafer size
Wafer size
  • Film thickness measurements are performed by stylus profilometry. A separate, partially-masked substrate is loaded along with each wafer and is used to measure the thickness of the as-deposited film.
Extra terms