Process Hierarchy

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  Nickel E-beam evaporation
Process characteristics:
Amount of material added to a wafer
Amount of material added to a wafer, must be 0.01 .. 2000 Å
0.01 .. 2000 Å
Material nickel
Sides processed either
Temperature 25 °C
Wafer size
Wafer size
Equipment SJ-20 evaporator
Equipment characteristics:
Batch sizes 100 mm: 8, 50 mm: 8, 75 mm: 8
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, no-flat, notched
Wafer holder
Device that holds the wafers during processing.
rotating orbital
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
gallium arsenide, glass (category), indium phosphide, Pyrex (Corning 7740), quartz (fused silica), silicon
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 1000 µm