logo
Register or Sign in

5x GCA E-beam reticle: View
Process Hierarchy
Bonding
Clean
Consulting
Deposition
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368

5x GCA E-beam reticle
Process characteristics:
Beam spot diameter
Area of the beam used to write the mask
Beam spot diameter*
Area of the beam used to write the mask
Batch size 1
Critical dimension tolerance 0.25 µm
Defect density
Density (by area) of defects of a given size (e.g., 1dpsi@1.0um).
 0dpsi@1um (automatic)
Feature geometry
Shape of feature with dimensions characterized by the minimum feature size
 line
Magnification 5
Mask coating
Mask coating material (eg. chrome).
 chromium
Mask material quartz (fused silica)
Mask plate dimension 5x5x0.90"
Min feature size 1 µm
Equipment
  Contact us    Search    Comment on this page