RCA clean with HF Dip (Pre-furnace clean): View

MEMS and Nanotechnology Exchange

Process Hierarchy
Bonding
Clean
Consulting
Deposition
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368

RCA clean with HF Dip (Pre-furnace clean)

1 RCA clean

2 HF Dip

Excluded materials

gold (category), copper

Wafer size

Comments:

This is the standard pre-furnace (deposition and oxidation) clean at Case Western Reserve University.

Extra terms

Customer agrees that wafers, masks, and other materials incorporating any process(es) provided by this fabrication site are to be used solely for non-commercial research purposes.