Thick film printing with low-temperature inks: View

Thick film printing with low-temperature inks

Process characteristics:

Material

Ink material used for printing.

Process duration

Fab enters the estimated processing time.

1 .. 4 hour

Thickness

5 .. 15 µm

Batch size

Excluded materials

gold (category), copper

Min feature size

4 mil

Temperature

110 °C

Wafer size

Equipment

MPM TF-100

Can also print on macor, kapton, nylon, and teflon substrates.

Equipment characteristics:

MOS clean

Wafer materials

List of wafer materials this tool can accept (not list of all materials, just the wafer itself).

alumina, glass (category), silicon

Wafer thickness

List or range of wafer thicknesses the tool can accept

100 .. 1000 µm

Comments:

The masks must be supplied by customer. CWRU can make masks only if that require features larger than 400um.

Extra terms

Customer agrees that wafers, masks, and other materials incorporating any process(es) provided by this fabrication site are to be used solely for non-commercial research purposes.