CMP: View

on front CMP

Process characteristics:

Materials

Specify material(s) to polish.

Materials

Available

Specify material(s) to polish.

Roughness

Required RMS roughness of the polished surface (if known).

unconstrained

Thickness removed

Thickness of material to be removed.

unconstrained

Sides processed

either

Equipment

Comments:

Chemical-mechanical polishing (CMP) is essentially mechanical polishing in which the slurry used is also an etchant for the surface to be polished. A system similar to mechanical polishing is used with some addition to contain the reactive slurry used. This type of polishing can be used to remove very small amounts of material with good precision.