Process Hierarchy

on front
  Electroplating
Process characteristics:
Material
Material*
Plating area
Area to be plated.
Plating area
Area to be plated., must be 0.31 .. 7850 mm2
0.31 .. 7850 mm2
Thickness
Amount of material added to a wafer
Thickness*
Amount of material added to a wafer, must be 1 .. 30 µm
1 .. 30 µm
Aspect ratio 0.1 .. 15
Sides processed either
Temperature 25 .. 60 °C
Equipment