Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
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  Evaporation (Evatek -Batch dome)
Process characteristics:
Adhesion layer material
Adhesion layer material*
Adhesion layer thickness
Adhesion layer thickness
must be 10 .. 500 Å
10 .. 500 Å
Material
Select one of the materials.
(contact for SiN, TiO2, TiN, and other reactive depositions requests)
Material*
Select one of the materials. (contact for SiN, TiO2, TiN, and other reactive depositions requests)
Temperature
Temperature for heated depositions.
Temperature
Temperature for heated depositions., must be 25 .. 350 °C
25 .. 350 °C
Thickness
Allowed thickness ranges:
Al: 0 .. 0.5um
Au: 0 .. 1um
B: 0 .. 3um
Cr: 0 .. 0.5um
Ni: 0 .. 1um
Pt: 0 .. 0.1um
Ti: 0 .. 0.1um
Si02: 0 .. 0.5um
Al2O3: 0 .. 5um
Thickness*
Allowed thickness ranges: Al: 0 .. 0.5um Au: 0 .. 1um B: 0 .. 3um Cr: 0 .. 0.5um Ni: 0 .. 1um Pt: 0 .. 0.1um Ti: 0 .. 0.1um Si02: 0 .. 0.5um Al2O3: 0 .. 5um, must be 0 .. 1 µm
0 .. 1 µm
Sides processed either
Wafer size
Wafer size
Equipment Evatek -Batch dome
Equipment characteristics:
Batch sizes 100 mm: 24, 150 mm: 9, 50 mm: 78, 75 mm: 33
MOS clean no
Wafer geometry
Types of wafers this equipment can accept
 1-flat, 2-flat, notched, no-flat
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 alumina, ceramic, silicon, Pyrex (Corning 7740), fused silica, silicon on insulator, Borofloat (Schott)
Wafer thickness
List or range of wafer thicknesses the tool can accept
 200 .. 800 µm