Process Hierarchy

  Titanium Oxide (Ti3O5) E-beam Evaporation Down
Process characteristics:
must be 0 .. 1 µm
0 .. 1 µm
Material titanium oxide
Wafer size
Wafer size
Equipment Yeagle E-beam Evaporator
Equipment characteristics:
Batch sizes 100 mm: 1, 150 mm: 1
MOS clean no
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, no-flat
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon on insulator, silicon, Borofloat (Schott), sapphire, fused silica, ceramic, alumina
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 1000 µm