Titanium Oxide (Ti3O5) E-beam Evaporation Down |
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| Process characteristics: |
| Thickness |
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| Material |
titanium oxide |
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| Wafer size |
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| Equipment |
Yeagle E-beam Evaporator |
| Equipment characteristics: |
| Batch sizes |
100 mm: 1, 150 mm: 1 |
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| MOS clean |
no |
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| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, no-flat |
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| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon on insulator, silicon, Borofloat (Schott), sapphire, fused silica, ceramic, alumina |
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| Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 1000 µm |
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