Process Hierarchy

on front
  STS polymer deposition
Duration 1 min
Gas C4F8, He
Sides processed either
Temperature 25 °C
Thickness 20 .. 100 nm
Wafer size
Wafer size
Equipment STS ASE DRIE
Equipment characteristics:
Batch sizes 100 mm: 1, 150 mm: 1
MOS clean no
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, notched, no-flat
Wafer holder
Device that holds the wafers during processing.
helium clamp
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
Wafer thickness
List or range of wafer thicknesses the tool can accept
250 .. 1000 µm