on front Metal sputter deposition (Veeco) |
|
| Process characteristics: |
| Material |
|
|---|
| Thickness Amount of material added to a wafer |
|
|---|
| Ambient Ambient to which substrate is exposed during processing |
argon |
|---|
| Pressure Pressure of process chamber during processing |
7 mTorr |
|---|
| Sides processed |
either |
|---|
| Wafer size |
|
|---|
| Equipment |
Veeco Connexion 800 |
| Equipment characteristics: |
| Batch sizes |
150 mm: 1 |
|---|
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, notched, no-flat |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon, fused silica, silicon on insulator |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
300 .. 900 µm |
|---|
