Process Hierarchy

on front
  E-beam metal evaporation (Temescal)
Process characteristics:
Thickness of material to be deposited.
Thickness of material to be deposited., must be 0.02 .. 1 µm
0.02 .. 1 µm
Sides processed either
Temperature 22 °C
Wafer size
Wafer size
Equipment Temescal FCE 2700A Evaporator
  • For metals-
    Dome (Lift-off) + Planetary
Equipment characteristics:
Batch sizes 150 mm: 15
MOS clean yes
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, notched, no-flat
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon, fused silica, silicon on insulator
Wafer thickness
List or range of wafer thicknesses the tool can accept
300 .. 900 µm