Process Hierarchy

on front
  5X I-line photolithography (OiR 897 10i)
  2 HMDS prime
MaterialArch OiR 897-10i
on front
  4 Photoresist softbake
Materialphotoresist (category)
MaterialArch OiR 897-10i
on front
  7 Microscope inspection
on front
  8 UV bake
Process characteristics:
Perform deep uv bake
Perform deep uv bake*
yes no
Resist thickness
Resist thickness*
Batch size 12
Feature geometry
Shape of feature with dimensions characterized by the minimum feature size
Field geometry
Shape of field with dimensions characterized by the maximum field size
Magnification 5
Material Arch OiR 897-10i
Max field size 10 mm
Min feature size 1 µm
Wafer size
Wafer size