Process Hierarchy

  Polyimide Softbake (hotplate-Durimide)
Ambient to which substrate is exposed during processing
Duration 50 s
Material Durimide 115A
Temperature 135 °C
Wafer size
Wafer size
Equipment Hotplate
Equipment characteristics:
Batch sizes 100 mm: 1, 150 mm: 1, 50 mm: 1, 75 mm: 1
Piece geometry
Geometry of wafer pieces the equipment can accept
circular, irregular, other, rectangular, triangular shard
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, no-flat, notched
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
fused silica, gallium arsenide, indium phosphide, other, Pyrex (Corning 7740), quartz (fused silica), quartz (single crystal), sapphire, silicon, silicon carbide, silicon on insulator
Wafer thickness
List or range of wafer thicknesses the tool can accept
300 .. 800 µm