Process Hierarchy

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  Spin casting (Durimide 7520)
Process characteristics:
Thickness of film to be deposited.
(cured thickness)
Thickness of film to be deposited. (cured thickness), must be 10 .. 40 µm
10 .. 40 µm
Batch size 1
Material Durimide 7520
Sides processed either
Equipment Headway Programmable Photoresist Spinner
Equipment characteristics:
Piece dimension
Range of wafer piece dimensions the equipment can accept
1 .. 6 inch
Piece geometry
Geometry of wafer pieces the equipment can accept
circular, irregular, other, rectangular
Piece thickness
Range of wafer piece thickness the equipment can accept
200 .. 800 µm
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
gallium arsenide, glass (category), other, silicon
  • Durimide 7500 series polyimides are photo-imageable polyimide precursors which are sensitive both in g- and i-line. They can therefore be imaged on all exposure tools. They are suitable for a wide range of applications on a wide range of substrates which includes silicon and gallium arsenide, alumina, and glass. They are not suitable for use on pure copper metalization. The major application in which Durimide 7500 series polyimides are used today is integrated circuit buffer coats.
  • The reported thickness is for the cured films. Softbaked films of Durimide 7520 have thicknesses of 18 um to 75um.