Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
  5X stepper align and expose
Alignment side front
Alignment tolerance
Registration of CAD data to features on wafer
 0.5 µm
Batch size 1
Feature geometry
Shape of feature with dimensions characterized by the minimum feature size
 equal line space
Min feature size 0.75 µm
Wavelength
Wavelength of light used during the exposure
 365 nm
Wafer size
Wafer size
Equipment GCA AS200 5x i-line stepper
  • Automatic wafer handling for 100mm wafers.
  • Automated wafer handling requires that wafers have flats.
  • Allowable wafer thickenesses: 50mm = 250..305um ; 75mm = 350..400um; 100mm = 500..550um; 150mm = 650..700um
  • Microscope objectives are 76.2mm fixed spacing apart. To perform split field alignment, space the alignment marks 76.2mm apart on the wafer. An offset alignment mark within the die may be neccessary depending on the die step size in X direction.
  • Reticles require special features around the edge. A template file may be provided in GDS format.
Equipment characteristics:
MOS clean yes
Wafer geometry
Types of wafers this equipment can accept
 1-flat, 2-flat
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 silicon on insulator, silicon
Wafer thickness
List or range of wafer thicknesses the tool can accept
 250 .. 550 µm
Attachments
[Thumbnail]GCA-AS200-stepper.jpg (27.2 KB, image/jpeg)
attached by ozgur (Mehmet Ozgur) on 2004-11-01 12:35
Picture of the stepper