GCA AS200 5x i-line stepper
Model AS200
Type commercial
Comments
  • Automatic wafer handling for 100mm wafers.
  • Automated wafer handling requires that wafers have flats.
  • Allowable wafer thickenesses: 50mm = 250..305um ; 75mm = 350..400um; 100mm = 500..550um; 150mm = 650..700um
  • Microscope objectives are 76.2mm fixed spacing apart. To perform split field alignment, space the alignment marks 76.2mm apart on the wafer. An offset alignment mark within the die may be neccessary depending on the die step size in X direction.
  • Reticles require special features around the edge. A template file may be provided in GDS format.
Equipment Characteristics
Batch sizes 10 .. 150 mm: 1
MOS clean yes
Wafer diameter(s)
List or range of wafer diameters the tool can accept
 10 .. 150 mm
Wafer geometry
Types of wafers this equipment can accept
 1-flat, 2-flat
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 silicon on insulator, silicon
Wafer thickness
List or range of wafer thicknesses the tool can accept
 250 .. 550 µm