Process Hierarchy

on front
  Photoresist coat (495 PMMA 6 A in anisole)
Batch size 1
Microstructure amorphous
Sides processed either
Thickness 3000 .. 6000 Å
Wafer size
Wafer size
Equipment Solitec 5100
Equipment characteristics:
Wafer holder
Device that holds the wafers during processing.
vacuum chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon, glass (category)
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 800 µm
  • This is a positive tone resist used for E-Beam, Deep UV (200-250nm), and X-Ray Lithographic process.