Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
on front
  Contact photolithography (Automated)
  1 HMDS Vapor Prime
on front
  2 Photoresist Spin Coat ACS200 (AZ 5214E)
  3 Photoresist Softbake ACS200
  4 Contact flat alignment and exposure
  5 Photoresist Develop (5214E)
  6 Linewidth Microscope Measurement
Process characteristics:
Alignment tolerance
Registration of CAD data to features on wafer
Alignment tolerance*
Registration of CAD data to features on wafer
unconstrained
Alignment type
Choose fine alignment if the mask will be aligned to the marks on the wafer.
Alignment type*
Choose fine alignment if the mask will be aligned to the marks on the wafer.
Min feature size
Min feature size*
unconstrained
Perform edge bead removal
Perform edge bead removal*
yes no
Perform hardbake
Hardbake or UV stabilization is optional for AZ5214E only.
Neither hardbake nor UV stabilization is available for AZ 9245.
Perform hardbake*
Hardbake or UV stabilization is optional for AZ5214E only. Neither hardbake nor UV stabilization is available for AZ 9245.
Perform linewidth metrology
Two measurement per wafer
Perform linewidth metrology*
yes no
Two measurement per wafer
Perform microscope inspection
30 mins inspection per wafer
Perform microscope inspection*
yes no
30 mins inspection per wafer
Perform stylus profilometry
One measurement per wafer
Perform stylus profilometry*
yes no
One measurement per wafer
Resist thickness
Resist thickness*
Batch size 1
Magnification 1
Wafer size
Wafer size
Comments:
  • The linewidth metrology includes measurements at two different sites on the wafer. Please provide details about the inspection sites, otherwise, if available only alignment marks will be inspected.
  • The microscope inspection includes only 30 mins of minimum inspection per wafer.
  • The stylus step-hight metrology includes only one measurement per wafer.
  • For any other or additional inspection, the customer will specify the location and nature of inspection, and it will be custom quoted.
  • See http://www.mems-exchange.org/users/litho-templates for information about layout requirements.
  • See http://www.mems-exchange.org/users/litho-templates for information about layout requirements.