Process Hierarchy

on front
  Gold Evaporation with Adhesion Layer
on front
  3 E-beam Evaporation (Cr)
on front
  4 E-beam Evaporation (Au)
Depth100 µm
Process characteristics:
Adhesion layer material
Adhesion layer material*
Gold thickness
Amount of material added to a wafer
Gold thickness*
Amount of material added to a wafer, must be 100 .. 2000 Å
100 .. 2000 Å
Perform clean
Perform clean*
yes no
Perform hf dip
Perform hf dip*
yes no
Perform stylus profilometry
Perform stylus profilometry*
yes no
Material gold
Wafer size
Wafer size