Process Hierarchy

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  Parylene C deposition
MaterialParylene C
Refractive index1 .. 4Thickness0 .. 50 µm
Process characteristics:
Apply adhesion promoter
Apply adhesion promoter*
yes no
Measure film thickness
Measure film thickness*
yes no
Perform clean
Perform clean*
yes no
Amount of material added to a wafer
Amount of material added to a wafer, must be 0.1 .. 15 µm
0.1 .. 15 µm
Batch sizes 100 mm: 3
Material Parylene C
Sides processed both
Wafer size
Wafer size
  • Thickness measurement can be done only if the Parylene film is on bare silicon.