Process Hierarchy

on front
  Photoresist coat (Shipley 3612)
on front
  2 100% HMDS prime
MaterialHMDS
MaterialShipley 3612
  4 Soft bake
  5 Hard bake
Process characteristics:
Resist thickness
Thickness of material to be deposited.
Resist thickness*
Thickness of material to be deposited.
Material Shipley 3612
Wafer size
Wafer size
Comments:
  • The film is hardbaked at 110 C for 25 min.