Process Hierarchy

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  Contact photolithography (Image reversal)
on front
  2 HMDS prime (manual)
MaterialHMDS
Process characteristics:
Resist thickness
Resist thickness*
must be 1.4 .. 2.8 µm
1.4 .. 2.8 µm
Feature geometry
Shape of feature with dimensions characterized by the minimum feature size
line
Field geometry
Shape of field with dimensions characterized by the maximum field size
circle
Magnification 1
Material AZ 5214
Max field size 100 mm
Min feature size 5 µm
Wafer size
Wafer size
Comments: